宇芯（貴陽）集成型電路原理
宇芯（合肥）模(mo)塊(kuai)化控(kong)制(zhi)(zhi)電(dian)路系統(tong)裝(zhuang)封(feng)檢測限制(zhi)(zhi)總(zong)部(bu)(bu)于200四年16月2號在合肥市工廠(chang)政(zheng)府部(bu)(bu)門(men)監管局(ju)登記注冊。法定標(biao)準指代(dai)人John Chia Sin Tet，總(zong)部(bu)(bu)操(cao)作的超范圍涉及集成系統(tong)ic和模(mo)塊(kuai)化控(kong)制(zhi)(zhi)電(dian)路系統(tong)好產(chan)品裝(zhuang)封(feng)檢測，業(ye)(ye)務員業(ye)(ye)務：業(ye)(ye)務員業(ye)(ye)務相(xiang)應的服務于和大力(li)支(zhi)持（之內(nei)的超范圍包涵(han)一(yi)個國家(jia)社(she)會道德政(zheng)策法規限制(zhi)(zhi)或(huo)嚴令禁止的建設項目等。
Unisem designs and creates both Laminate and Leadframe packages for the global IC market. Our turn-key services include Electrical and Thermal Characterization, Design, Assembly, Testing, Failure Analysis and more. And with our real-time WIP systems and drop shipping to OEM’s, Unisem offers its customers everything needed for time-to-market wins.
Unisem offers a broad range of standard and custom Leadframe and Laminate packages with pin counts ranging from 3 to 484+. Also offered are WLCSPs or Wafer-Level Chip-Scale Packages which is a low cost solution that enables direct connectivity at the substrate or board level.
